Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs
نویسندگان
چکیده
منابع مشابه
Fabrication of metallic electrodes with nanometer separation by electromigration
A simple yet highly reproducible method to fabricate metallic electrodes with nanometer separation is presented. The fabrication is achieved by passing a large electrical current through a gold nanowire defined by electron-beam lithography and shadow evaporation. The current flow causes the electromigration of gold atoms and the eventual breakage of the nanowire. The breaking process yields two...
متن کاملDiffusivity variation in Electromigration failure
Electromigration driven void dynamics plays an important role in the reliability of copper interconnects; a proper understanding of which is made more difficult due to local variations in line microstructure. In simulations, the parameter which best incorporates these variations is the effective atomic diffusivity D eff which is sensitive to grain size and orientation, interface layer thickness...
متن کاملislanding detection methods for microgrids
امروزه استفاده از منابع انرژی پراکنده کاربرد وسیعی یافته است . اگر چه این منابع بسیاری از مشکلات شبکه را حل می کنند اما زیاد شدن آنها مسائل فراوانی برای سیستم قدرت به همراه دارد . استفاده از میکروشبکه راه حلی است که علاوه بر استفاده از مزایای منابع انرژی پراکنده برخی از مشکلات ایجاد شده توسط آنها را نیز منتفی می کند . همچنین میکروشبکه ها کیفیت برق و قابلیت اطمینان تامین انرژی مشترکان را افزایش ...
15 صفحه اولLeakage and Variation Aware Thermal Management of Nanometer Scale Ics
For sub-100 nm CMOS technologies, leakage power forms a significant component of the total power dissipation, especially due to within-die and die-to-die variations in process (P), temperature (T) and supply voltage (V). Since leakage power and operating temperature are electrothermally coupled to each other, increasing power dissipation and thermal problems are becoming key concerns not only f...
متن کاملDamage mechanics of electromigration induced failure
Electromigration is a major road block in the pursuit of nanoelectronics and next generation power electronics. The current density in the state-of-the-art microelectronics solder joints is about 10 A/cm. In the next generation nanoelectronics solder joints this current density is expected to increase by an order of magnitude, at least. In this paper, a new damage mechanics formulation is imple...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
سال: 2020
ISSN: 0278-0070,1937-4151
DOI: 10.1109/tcad.2019.2907908